PLASMA CONSULT PLASMA SOURCES

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HCD-L 300 (linear)

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HCD-P 100 (planar type)

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SLAN Series (available in 4, 16 and 67 cm diameters)

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ICP-P 200

 Hollow Cathode 13.56 MHz RF Plasma Sources
Operation over an extended power and pressure range
High plasma and radical species densities with excellent homogenity (1011 cm-3)
Compatible with chemical reactive and non-reactive gases
Cw and pulsed power operation
Low contamination
Linear type also available in 600 mm and 900 mm
Applications:
Plasma enhanced chemical vapor deposition (PECVD)
Plasma polymerization, plasma cleaning, plasma etching
Surface modification
 
SLAN (SLot ANtenna) 2.45 GHz Microwave Plasma Sources
High plasma densities
Pressure range from 10-5 mbar up to atmospheric pressure
Compatible with chemically reactive and non-reactive gases
Low contamination
ECR and non-ECR operation
Cw and pulsed operation
Available in 4, 16 and 67 cm diameters
Applications:
Plasma enhanced chemical vapor deposition (PECVD)
Plasma polymerization, plasma cleaning, plasma etching
Surface modification
Material science
 
Inductively Coupled Plasma Source ICP-P 200 (13.56 MHz)
Planar coil with 200 mm diameter
Extended power range (3-1200 W)
Low ion energy with narrow energy spread
High plasma and radical densities
Low contamination
Cw and pulsed operation
Applications:
Plasma enhanced chemical vapor deposition (PECVD)
Plasma polymerization, plasma cleaning, plasma etching
Surface modification
MaterialS science