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Reactive Ion Etching Systems
The
NRE-4000 is a stand alone Reactive Ion Etching (RIE) system with
shower-head gas distribution and water cooled RF platen. It has a
stainless steel cabinet and a 13” cylindrical Aluminum chamber that
opens from top for wafer loading. Chamber has two ports, one with a 2”
window the other with a blank off for end point detection and for other
diagnostic. It can accept up to 8” wafers. Chamber is extremely clean in
design and reaches 10-6 Torr or lower base pressure depending
on the pumping package. It can be operated in the pressure range of 20
mTorr to 8 Torr. Pumping package consists of a throttle valve, 250 l/sec
corrosive turbomolecular pump, sieve filter, and a 10cfm mechanical pump
with fomblin oil. The RF power is provided by 600 W 13.5 MHz power
supply, and auto-tuner. The self DC bias is continuously monitored and
reaches as high as -500 V which is important for anisotropic etching.
The system is completely automated and is PC controlled. The real time
system pressure and DC bias is displayed in graphic format while flow
and power is displayed in alpha numeric format. Four levels of
authorization Auto, Engineering, Process and Maintenance prevents
unauthorized use of the system while giving maximum flexibility to user
for setting up recipes in Process mode and running in Auto mode with
high reproducibility.
Features:
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Aluminum or Stainless Steel Chamber
•
Stainless Steel Cabinet
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Capable of etching Si compounds (~400 Å /min)and metals
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Typical Si etch rate, 400 Å/min
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8“Anodized RF Platen
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Water Cooled and Heated RF Platen
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Large Self Bias
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Shower Head gas distribution
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Approximately 10-6 Torr < 20 minutes, ~ 5 x10-7
Torr base pressure
•
Turbomolecular Pump
• Up
to four MFC’s on NRE-3000 and up to eight MFCs on NRE-4000
• No
flexing of gas lines
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Down Stream Pressure Control
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Dual Etch capability: RIE and Plasma Etch
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End Point Detection
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Pneumatically Lifted Top
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Manual or automatic loading/unloading,
•Load Lock
• PC
Controlled with LabVIEW
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Recipe Driven, Password Protected
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Fully Safety Interlocked
•Optional ICP source and cryogenic cooling of the platen for deep Si
etch
Models
NRE-4000 Stand Alone System, 26“D x 44”W Footprint
NRE-3500 Stand Alone Compact System, 26”D x 26”W Footprint
NRE-3000 Table Top System, 26”D x 26”W Footprint
NRP-4000 Dual RIE/PECVD System
NDR-4000 Deep RIE System
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