E-Beam Evaporating System

2. Products
3. Deposition
4. E-Beam

NEE-4000

E-Beam Systems

The Electron Beam Evaporation System is available in two different configurations. A compact vertical dual chamber configuration features a 14" cube main chamber where the platen is located, and underneath the main chamber a secondary chamber is provided for housing the e-beam source. This configuration can be provided with a gate valve between the two chambers to be used as a load lock to keep the e-beam source and the evaporation pockets in vacuum while substrates are loaded and unloaded from the main chamber. For applications where automatic loading and unloading of wafers are needed, a third load lock chamber is attached to the left face of the cube for another load lock. In this case, the main chamber can be kept at low 10^-7 Torr range at all times and evaporation can start just a few minutes after loading the wafer. The second configuration features a single large chamber design that allows e-beam evaporation guns, magnetrons, and thermal evaporation mounted onto the baseplate. In this configuration coating of mulitple wafers are possible using planetary substrate holder.

NANO-MASTER offers combinatorial evaporation system using substrate masking and computer controlled evaporation rates for individual e-beam evaporators

System Configurations