Reactive Ion Etching
NRE-4000
RIE Systems
NANO-MASTER’s NRE-4000 is a stand alone Reactive Ion Etching (RIE) system with showerhead gas distribution and water cooled RF platen. It has a stainless steel cabinet and a 13" cylindrical aluminum chamber that opens from the top for wafer loading. It can accept up to 8" (200 mm) wafers. The chamber has two ports, one with a 2" window the other with a blank off for diagnostic equipment such end point detection. The chamber is extremely clean in design and reaches a base pressure in the 5x10-7Torr range or lower depending on the pumping package. It can be operated in the pressure range of 20mTorr to 8Torr. The standard pumping package has a 250 l/sec corrosive turbomolecular pump, sieve filter, and a 10cfm PFPE prepared backing pump. The RF power is provided by 600W 13.5MHz power supply, and an auto-tuner. The substrate DC bias is continuously monitored and reaches as high as -500V, which is important for anisotropic etching. The system is PC controlled recipe driven giving maximum flexibility to user while maintaining high reproducibility. Single wafer and cassette to cassette auto load/unload are available.
- 13” aluminum hard anodized chamber
- Showerhead gas distribution
- Up to 200mm substrates
- MFC’s with SS gas lines
- DC Bias: up to -500V self bias, up to -1000V external bias
- Automatic pressure control
- 600W RF power supply with auto tuner
- Water cooled or heated (400°C) platen
- 250l/sec corrosive turbomolecular pump with suitable backing pump
- Fully automated PC based, recipe driven
- LabVIEW user interface
- Fully safety interlocked
- ICP high density plasma source for high rate etching
- Plasma source for isotropic etching
- He backside cooling with mechanical clamp for DRIE
- Additional MFC’s
- Auto load/unload
- Substrate cooling down to -20°C and heating up to 200°C
- Spectroscopic End Point Detector
- Electostatic chuck
- 12" wafer chamber
- Compound Semiconductors
- GaAs sensor
- Photonics
- MEMS device fabrication
- Deep trenches in silicon etching
- Plasma dicing for advanced pakaging
- Etching Visa for TSV fabrication
- High precision motion sensors
- Nano Scale etching and microfluidics
