Deep Reactive Ion Etching
NDR-4000
DRIE Systems
NANO-MASTER DRIE systems incorporate a planar ICP source for high density plasma generation. Our systems have the ability to be used both with Cryo etch and Bosch processes that can create deep penetration, steep-sided holes and trenches in wafers with high aspect ratios.
- NM-ICP downstream high density shower-head plasma source
- Compatible with Bosch and Cryo etch processees
- 13" Aluminum hard anodized chamber
- Reduced chamber volume ensuring high gas conductance and short step times
- Up to 200mm substrates
- Mechanical chuck with He backside cooling
- 1kW RF power supply with Auto Tuner for ICP source
- 600W RF power supply with Auto Tuner for substrate bias
- RIE mode for low etch rate applications
- PC based fully automatic recipe or manually driven control system
- State of the art user interface
- EMO protection and safety interlocks
- Electrostatic Chuck with He backside cooling
- Extra MFC’s with SS gas lines
- Auto L/UL
- Spectroscopic end point detector
- Silicon wafer dicing.
- MEMS
- Deep trenches in Silicon etching
- High precision motion sensors
- Nano Scale Etching
- Microfludics