Sputtering
NSC-4000 with auto load/unload sputter-up configuration
Sputtering Systems
NANO-MASTER's state of the art Sputtering Systems can be constructed with various chamber and source configurations for depositing metals and dielectric thin films on to substrates up to 200 mm. The systems can be equipped with DC, RF and Pulsed DC power supplies to enable sequential or co-sputtering. The systems come with a turbomolecular pumping package to achieve a base pressure of 5x10-7 Torr. Magnetron to substrate distance is adjustable in order to achieve desired uniformity and deposition rate. Rotating platen with off axis magnetrons provide means of achieving the best film uniformity. Crystal thickness monitor is provided for terminating process automatically. Platen can be heated up to 800°C and RF biased.
- Electropolished 14” cubical chamber optimized for sputtering
- 5x10-7 Torr base pressure attained with turbomolecular pumping package
- Single or multi magnetron configuration with varying target sizes
- Sequential sputtering/co-sputtering
- Adjustable magnetron to substrate distance
- 1” to 6” planar magnetron sizes
- Source and substrate shutters
- MFC with electro polished gas lines
- 4” viewport with manual shutter
- Quartz crystal thickness sensor
- Substrate rotation
- Fully automated PC based, recipe driven
- LabVIEW user interface
- EMO protection and safety interlocks
- Substrate heating up to 800°C or cooling
- Glancing Angle Deposition (GLAD) with rotation
- Custom chamber sizes
- 1.5-5kW Pulsed DC power supply for ITO/ZnO like materials
- Tilted magnetrons
- RF biased substrate
- Ion source for substrate cleaning
- Ion assisted sputtering
- Additional RF nad DC power supplies for co-sputtering
- Thermal and E-beam sources
- Additional MFC’s for reactive sputtering
- Automatic load/unload
- Various pumping options including cryo pumping stations
- Optical coatings, and ITO Coatings
- Hard coatings
- Protective coatings
- Microelectronics patterning
- TCO in OLED applications
